United Kingdom-SOUTHAMPTON: Wafer Dicing Saw and Post Wafer Cleaning
This is a preview of contract award: United Kingdom-SOUTHAMPTON: Wafer Dicing Saw and Post Wafer Cleaning that was published on August 4, 2024. To gain full access you will need to login or start your FREE trial.
Title: United Kingdom-SOUTHAMPTON: Wafer Dicing Saw and Post Wafer Cleaning
Description:
The University of Southampton seeks to acquire a complete dicing system for the University's optical and semiconductor materials processing capabilities for a number of high-impact projects in the major engineering themes of Quantum Technologies, Photonic...
Published Date: August 4, 2024
Industry Sector: Technology and Equipment
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